Drying

PCBs are sensitive to ambient humidity, they are hygroscopic.

This moisture stored in the PCB can create damage during the soldering process.

The water vapor being released very quickly, it can cause delamination, micro cracks ...

To avoid this phenomenon, it is advisable to steam the PCBs before wiring.
This process is all the more important for Flex and Rigid Flex. Polyimide absorbs moisture more easily than FR4
With drying, the objective sought is that opposite to the absorption of moisture: diffusion of moisture to the surface and then evaporation of it.

This process must be done with a forced air drying oven.
Each process is different. T he information we give is indicativeand must be validated by the EMS.

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