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Product parameters
Layer: 4
Board Thickness(mm): 1.6
Copper Thickness(oz): 1
Surface Treatment: LF HAL
Solder Mask: TOP Blue BOT Blue
Silk Screen: TOP White BOT White
Test: Flying
Min Width(mil): 5.2
Min Spacing（mil): 6.7
Min Hole Diameter(mm): 0.4
Aspect Ratio: 4
Gold Finger
TG: 170
Application Fields:
Widely used in communication, security, medical, industrial control, consumer electronics filed and so on.
Layer: 4
Board Thickness(mm): 1.6
Copper Thickness(oz): 1
Surface Treatment: LF HAL
Solder Mask: TOP Blue BOT Blue
Silk Screen: TOP White BOT White
Test: Flying
Min Width(mil): 5.2
Min Spacing（mil): 6.7
Min Hole Diameter(mm): 0.4
Aspect Ratio: 4
Gold Finger
TG: 170
Application Fields:
Widely used in communication, security, medical, industrial control, consumer electronics filed and so on.